Manufacturing Process
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Gms/cm |
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(at 20°C) Cal/gm/ °C |
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conductivity at 20°C %IACS. |
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Solidus Temp. °C | Liquidus Temp. °C | ||||||
Electrolytic Cu (ETP) | 8.89 - 8.9 | 1065 | 1083 | 17.7 | 0.092 | 0.934 | 101% |
DHP Cu | 8.94 | 1065 | 1083 | 177.7 | 0.092 | 70-87 | 70-80 |
DPA Cu | 8.94 | 1065 | 1082 | 18 | 0.092 | 35-45 | 35-45 |
TELLURIUM Cu (0.5 Tel) | 8.94 | 1050 | 1080 | 17.8 | 0.092z | 0.88 | 0.95 |
70/30 Cartridge Brass | 8.53 | 915 | 955 | 19.9 | 0.090 | 0.29 | 0.28 |
Admiralty Brass | 8.53 | 900 | 935 | 20.2 | 20.2 | 0.09 | 0.26 25% |
Aluminium Brass | 8.33 | 930 | 970 | 18.5 | 0.090 | 0.24 | 23% |
70/30 Cu. Ni. | 8.94 | 1100 | 1150 | 17.1 | 0.090 | 0.11 | 9% |
90/10 Cu. Ni. | 8.94 | 1170 | 1240 | 16.2 | 0.090 | 0.07 | 46% |